NxQ 8008 CT Production Mask Aligner
Thông số cơ bản
| Tiêu chuẩn: | Photolithography, mask alignment, contact and proximity printing |
| Ứng dụng: | Microelectronics, LED / HB LED, 3D IC, SIOP, WLP, MEMS, BioMEMS, MicroFluidics, Compound Semiconductor, Solar, Optoelectronics |
| Công nghệ phân tích: | Photolithography, Mask Alignment, UV-LED Exposure |
| Nhà cung cấp: | Neutronix Quintel |
| Model: | NxQ 8008 CT Series |
- NxQ 8008 CT Series is a scalable, high volume production mask aligner platform.
- It integrates robotic automation with a next generation production design.
- The system supports full-field exposure, precision alignment and substrates up to 200 mm.
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NxQ 8008 CT Production Mask Aligner
NxQ 8008 Cluster Tool Series – Scalable, High Volume Production Platform
NxQ 8008 Cluster Tool Series is a scalable, high volume production platform.
It is developed by Neutronix Quintel for advanced photolithography applications.
The system is designed as a production mask aligner.
It integrates robotic automation with a next generation design from Milara, Inc.
NxQ 8008 CT Series supports precision alignment and exposure.
It is suitable for R&D, pilot line and high volume manufacturing.
NxQ 8008 CT Production Mask Aligner – Cluster Tool Production Mask Aligner
The NxQ 8008 Cluster Tool Production Mask Aligner integrates the latest robotic automation.
It also uses a state-of-the-art next generation design.
The system includes a dual arm robot.
This robot delivers fast wafer transfer.
It also incorporates a pre-aligner from Logosol.
The pre-aligner can detect transparent substrates.
This makes the system suitable for silicon.
It is also suitable for a wide range of compound semiconductor materials.
Automated Mask Loading
The NxQ 8008 CT Mask Aligner offers automated mask loading options.
It uses a front load port design.
The front load ports are SMIF load port upgradeable.
This is achieved while maintaining the footprint of the tool.
This design supports production operation.
It also helps improve workflow in cleanroom environments.
NxQ 8008 CT Production Mask Aligner – Alignment Stage
The NxQ 8008 CT Alignment Stage uses the latest linear motion technology.
Encoder feedback loops measure the actual stage position.
The system measures stage position directly.
It does not only measure motor position.
This allows the vision system to support high alignment performance.
The system can achieve alignment accuracy of less than 0.5 µm, 3 sigma.
This accuracy is achieved using the Quadcam Microscope.
The microscope uses 5x objectives.
This combination provides magnification, field of view and depth of focus.
NxQ 8008 Cluster Tool Series – Scalable, High Volume Production Platform
NxQ 8008 CT Production Mask Aligner – Standard Features
NxQ 8008 CT Series includes the following standard features:
Full-field exposure up to 200 mm diameter
UV-LED broadband or I-Line exposure source
Tuneable exposure source
Top side alignment 0.5 µm +/- 3 sigma
Backside alignment 0.75 µm +/- 3 sigma
Manual or automatic operation
Extremely small cleanroom footprint
Suitable for R&D, pilot line or HVM
Technical Specifications
- Alignment Stage utilizes the latest in linear motion technology with encoder
feedback measuring actual stage position (not motor position)
Substrate Flexibility
• Up to mm thick.
• Si, Glass, Ceramic, Flexible.
• 2″ to 8″ Robot Load.
• Round, Square, Irregular. - Exposure Modes
Soft, Pressure, Vacuum Contact and Proximity Printing Modes - Print Resolution
Proximity 4 um at 20um gap
Soft Contact 3 um
Hard Contact 2 um
Vacuum Contact 1 um
Note: Achievable resolution depends on many process conditions including wafer
m flatness, resist type and therefore might vary according to the actual process. - Alignment Accuracy (+/- 3 sigma)
Top Side Alignment (TSA) (Contact) 0.5um (Proximity) 0.5um
Backside Alignment (BSA) (Contact) 0.75um (Proximity) 0.75um - Alignment Stage
Alignment Travel X-Y and Theta Motorized with automatic re-centering
X-Y Movement +/- 4mm, 50nm resolution
Theta Rotation Range +/-4 degrees, 4×10-4 °/μ resolution
Mask/ Wafer separation 0 – 1000um with 1um resolution - Microscope Travel Range
R/L Microscope Travel in X ± 22mm to 150mm
R/L Microscope Travel in Y +12.7mm to – 88mm - Top Side Microscopes
UHD Quadcam Microscope
5x Objectives with Digital Zoom, Optional 2x or 7.5 x - Electronics / Connectivity
Windows 11 64-bit
SECS / GEM, OCR, Barcode
Local / Remote Diagnostics - UV-LED Exposure Optics
Standard UV LED Optics
Polychromatic (GHI spectrum), recipe set 20 – 100%, Uniformity ±3%.
o Intensity Output Range
• Up to 27 mW/cm2 I – Line
• Up to 68 m W/cm 2 Broadband
Standard UV LED Optics
Polychromatic (GHI spectrum), recipe set 20 – 100%, Uniformity ±3%.
o Intensity Output Range
• Up to 70 mW/cm2, I – Line.
• Up to 160 mW/cm2, Broadband. Standard UV LED Optics
High Power I-line unit, recipe set 20 – 100%, Uniformity ±3%
o Intensity Output Range
• Up to 138 mW/cm2, I – Line.
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